Non-contact measurement with light

Kopfbild Messgroessen 960x280-en

Filter section:

  • Bulk solid silo
  • Cement storage
  • Coil lines, Inspection lines
  • Coil storage
  • Coiling machines
  • Container ports
  • Conveyor belt
  • Decapper
  • Engineering
  • Extruder
  • Filling plant
  • Final assembly
  • Finishing, Slitting line, Winder
  • Finishing, Slitting lines
  • Flying saw
  • Forge hammer
  • Gantry cranes
  • Hot objects
  • Laboratory
  • Packing
  • Ports, docking systems
  • Printing machine, banderoling machine, register control
  • Quality assurance
  • Railway, Transportation
  • Research and Development
  • Service, Commissioning, Research
  • Skin pass level, degree of stretching, mass flow
  • Slitting shears
  • Steel billets
  • Tube inspection lines

Filter task:

  • Abrasion measurement
  • Coating inspection
  • Coating inspection of foam material
  • Collision avoidance
  • Color inspection
  • Color mark detection
  • Color measurement of salmon meat
  • Control of shears
  • Distance measurement
  • Egg yolk color classification
  • Fill level measurement
  • Length measurement
  • Measurement of impact energy
  • Mobile velocity and length measurement
  • PET preform inspection
  • Position detection
  • Positioning of containers in gantry cranes
  • Presence check
  • Print mark detection
  • Sandwich counter
  • Velocity Measurement
  • Velocity measurement, Length measurement

Filter measured variable:

  • Acceleration (VLM)
  • Color (CR)
  • Degree of stretching and Skin pass level (VLM)
  • Diameter (LDM)
  • Distance (LDM)
  • Fill level (LDM)
  • Impact energy (VLM)
  • Length (LDM)
  • Length (VLM)
  • Position (CR)
  • Position (LDM)
  • Position (VLM)
  • Position detection (CR)
  • Presence (CR)
  • Presence (LDM)
  • Quantity (CR)
  • Thickness (LDM)
  • Velocity (VLM)
  • Velocity 1 (LDM)
  • Velocity 2 (LDM)
  • Width (LDM)



Task:
Presence check
Areas:
Decapper
Measured Variables:
Presence (CR)
Description:
The correct ejection of wafers in wafer baking systems is checked with a color sensor. Here, the color difference between the wafer and the baking tin is assessed. Fiber optic coupling helps uncoupling the sensor from thermal influences to the greatest extent. Due to the dual-channel mode two measured points can be monitored at the same time.
Products: CR200, CR200E, CR200EI, CR200P, CR200PN, CR210, CR210E, CR210EI, CR210P, CR210PN

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